PVC Non-UV Dicing Tape with Liner for Wafer Back Grinding

Professional PVC Non-UV Dicing Tape for Wafer Back Grinding

Product Overview: Our PVC Non-UV Dicing Tape is an essential process material designed for the semiconductor industry, specifically for wafer back grinding (BG) and surface protection. Unlike UV-curable tapes, this non-UV version utilizes a specialized pressure-sensitive adhesive (PSA) that provides a secure bond during mechanical grinding while allowing for a clean, damage-free release afterward. The high-quality PVC base ensures excellent flexibility and stress distribution, shielding sensitive circuits on the wafer front side from water, debris, and mechanical pressure.

Technical Specifications & Critical Advantages

• Superior Grinding Protection: Provides a robust buffer layer that prevents wafer breakage and surface scratches during high-pressure back grinding cycles.

• Controlled Initial Adhesion: Engineered with the perfect balance of "grip and slip"—strong enough to hold the wafer firmly, yet gentle enough to peel off without stressing ultra-thin silicon.

• Excellent Thickness Uniformity: Minimal Total Thickness Variation (TTV) ensures precise grinding results and prevents uneven wafer thinning.

• Residue-Free Guarantee: The specialized adhesive formula leaves zero ionic contamination or sticky residue on the wafer surface, maintaining the integrity of the subsequent dicing and bonding steps.

• Chemical & Water Resistance: Formulated to withstand the cooling water and grinding slurries used in semiconductor fabrication without losing bond strength.